Hereblow is our FAE's remark for your RD ref.
1. As we hear you that your current thermal pad with additional 3M 467 due to current thermal pad with very lower tacky suface, if with additional 3M 467 which increase its contact thermal resistance enormously and impact on its structural thermal performance for bad compress.
2. Technically , 3M 467 is of thermal conductivity as low ad 0.17w/m.k and after coating with thermal pad of 2.5 w/m.k as a reference, the achieved theoretical thermal conductivity is 1.5w/m.k.
3. Bad re-workability.
Our Suggestion is to have no additional adhesive as blow highlight
1. Our company SinoGuide TCP series TCP500/TCP750 http://www.sg-thermal.com/Thermal-Pad/7_5W_m_k_Heat_Conductive_Silicon_Thermal_Heatsink_Pad_162.html is of excellent tackiness to small IC or metal plates for assembly.
2. Natrual tacky and requires no additional adhesive coating than can inhibit thermal performance.
3. High compressible gap filling produces incredibly low thermal resisitances, conformaing well to IC and heat sinks as silicone molecular structure has a good conformity with IC surface for long-term and stable reliability.
4. Good re-workability and Easy to pick-up for handling for lowering your assembly cost. Pls help to explain to your RD for above technical comments, super thanks in advance.
About SinoGuide: (http://www.sg-thermal.com/)
SinoGuide's Thermal team is committed to improving the overall reliability of electronic devices, focusing on widely range of thermal conductive materials design and manufacturing process. Our broad project portfolio and roots in advanced manufacturing result in cost-effective solutions while improving product functionality and quality.